ABF製程

ABF Process application

Desmear ABF
  • Desmear ABF series is a advance desmear process for high-end IC substrate with Semi-Additive Proecss(SAP)
  • Excellent micro roughness on ABF materials for Supreme good adhesion with the  electorless copper and plating copper.
Electroless Copper ABF
  • Special design for high-end IC substrates under SAP and MSAP application
  • High throwing power
  • Excellent coverage and adhesion on ABF material
  • Low internal stress deposition
  • Environmentally friendly composition, EDTA free,cyanide free
  • High peel strength under low Ra material
  • High Purity copper depositionwith low resistivity, good for via filling performance.
After Desmear Prodess (GL-102)
After Electroless Cu Process (GL-102)

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