水平化學銅製程

Electroless Copper MB

Electroless Copper MB is a Lower internal stress electroless copper
  • Application : advanced materials as Rigid-Flex, 5G,Low dk/df, highTg materials.
Compatible with different equipment system
  • Vertical equipment
  • Horizontal equipment
  • Vertical continues equipment
  • Friendly complexing agent based on tartrate
  • Superior hole wall adhesion for Helogen-free and High Tg base material
  • Helogen-free and High Tg base
  • Enhance electroless copper adhesion on rigid and flex base materials
  • Low stress deposit,without Blister onthe flex and High Tg base material
After elecgtroless Cu

Electroless Copper HT

Electroless Copper HT, High throwing power electroless copper
  • Application : advanced HDI, any-Layer,MSAP technology, best for High-end IC substrate
Throwing power (TP) = B1+B2 / T1+T2 x 100%
Electroless Copper HT
  • Excellent throwing power performance
  • Electroless Copper HT providesa superior throwing power of blindmicro vias.
  • Electroless Copper HT is fully compatible to Jetchem's established Desmear and PTH processes for Horizontal technology.
  • Highest reliability performance
Hole diameter: 76 um depth : 80 um TP: -100%

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