貫孔電鍍-化學銅製程
PTH (Plating Through Hole)
Jetchem’s alkaline activator system provides a very dense
and uniform Palladium layer, with an excellent initial
overage power to the electroless copper.
Alkaline Activator system
- Less Pink-ring phenomenon with Multilayers
- High Stability of Activator
- Without Tin residue problems
- Without HCI present in the activator, and no Corrosion in plant area
High reliability and performance
- Superior bath stability
- Low foaming activator
- Minimal palladium absorption by copper surface
- Compatible with current level PTH equipment Horizontal Process
- Lower Operation Costs
Widely application with different equipment system
- Activator PC-65-Vertical application
- Activator VCF-Vertical continues application
- Activator PC-65H-Horizontal application
- Activator LC-Horizontal application
- Activator 4.0 – Horizontal application
Type of Eletroless Copper
Low Speed/薄銅
Electroless Copper 168 1.2–1.7 um/h
Electroless Copper RF 1.2–1.7 um/h
Electroless Copper ECT-H 1.8–2.5 um/h
Electroless Copper RF 1.2–1.7 um/h
Electroless Copper ECT-H 1.8–2.5 um/h
Medium Speed/中速銅
Electroless Copper MC 2.6–3.0um/h
Electroless Copper MB 2.5–3.0um/h
Electroless Copper VCF 2.6–3.0um/h
Electroless Copper HT 2.5–3.0um/h
Electroless Copper HTR 2.4–3.0um/h
Electroless Copper MB 2.5–3.0um/h
Electroless Copper VCF 2.6–3.0um/h
Electroless Copper HT 2.5–3.0um/h
Electroless Copper HTR 2.4–3.0um/h
High Speed/厚化銅
Electroless Copper 910 4.0–6.0 um/h
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