Copper cleaning and Copper Reduction
Innerlayer surface treatment
- Black/Brown Oxide process
- Jetcoat process (Oxide replacement)
Lamination application-
High Tg base material
- It is intended to increase the adhesive strength between the inner layer and prepreg.
- It is named based on the board color of its surface treatment.
- Compare to black oxide, it has less processing steps and is pink-ring free.
- Oxide replacement has good strength, preventing if from peeling even after heatshocking.
- The brown oxide prevents delamination when enhancing the adhesive strength between prepreg and Cu.
- The Jetcoat HT process is able to maintain its high peel strength at law Etch Rate.
DLD (Black Oxide Process & Jetcoat Process Direct Laser Drilling)
- Less process steps
- Better registration
- Cost reduction
- Advantage:
- Excellent surface uniformity
- Consistent weight gain
- Superior anti-scratching capability
Vertical Process-Direct Laser Drilling
- Black Oxide LD Process
- Excellent surface uniformity
- Consistent weight gain
- Superior anti-scratching capability
- Consistent Hole size
- Minimizing the undercut
Horizontal Process-Direct Laser Drilling
- Black Oxide LD-H Process
- Controlled crystal growth
- Easy to operate thinner PCB
- Provided the most stable and most uniform surface treatment
- Significantly less surface copper thickness loss after process
- Best for MSAP application with ultra thin copper clad
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